With the rapid evolution of consumer markets and increasingly diversified demands, higher requirements are being placed on product quality. As one of the most widely used passive components, SOREDE hot-press integrated molding inductors adopt an innovative low-pressure molding technology.
Compared with conventional dry pressing processes, the hot-press molding transfer technology operates at extremely low forming pressure—only about 5% of the pressure used in dry pressing (400 MPa–1000 MPa). This significantly reduces the risk of damaging the coil insulation layer or breaking solder joints during the molding process, fundamentally eliminating the long-standing industry issue of “open circuit / short circuit” failures.
The product series currently covers sizes including 2.0 / 2.5 / 04 / 05 / 06 / 07 / 08 / 10 / 15 / 17 mm.
Traditional integrated molded inductors typically use high-pressure molding processes and copper lead-frame structures. Under high pressure, the coil insulation layer may be damaged, increasing the risk of short circuits. In addition, the solder joints of copper lead frames are prone to open-circuit failures. These issues are particularly unfavorable for high-reliability applications such as industrial and medical equipment.
In contrast, SOREDE hot-press integrated inductors adopt low-pressure hot-press molding technology combined with bottom electrode structures, fundamentally eliminating the open- and short-circuit risks associated with molded inductors. At the same time, the use of low-loss magnetic materials provides higher reliability and improved electrical performance.
Product Features
• High reliability
• Operating temperature range: –55°C to +155°C, with no long-term high-temperature aging issues
• Excellent saturation current characteristics
• Ultra-low DCR / ACR
• Low loss for higher power conversion efficiency
• Bottom electrode structure enabling high-density mounting
• Reduced risk of short circuits between adjacent components
Product Structure:
• Metal Magnetic Core: Self-developed metal magnetic powder with low loss and high performance
• Coil: Flat enamelled copper wire to reduce internal resistance
• T-Core: Metal magnetic powder to enhance inductance performance
• Bottom Electrode: Electroplated copper, nickel, and tin to improve adhesion and reduce internal resistance
Product Applications:
Automotive electronics, high-end smartphones, tablet computers, 5G modules, servers, base stations, DDR5, and various DC-DC power conversion modules.
Product Size Specifications and Characteristics:
Sample Request
SOREDE provides free samples and technical support to help accelerate your product development.
Sample Request Channels:
● Mobile: +86 133 1296 7899 (WeChat available)
● QQ: 853065556
● E-mail: sorede@vip.szsorede.com
